Automatic Solar Cell Fiber Laser Scribing Machine

The Automatic Solar Cell Fiber Laser Scribing Machine is a core photovoltaic production equipment that utilizes a high-precision fiber laser source to perform fully automatic, ultra-precise, high-speed, and nearly non-destructive cutting (scribing) on silicon-based solar cells. It is designed to achieve cell segmentation or specific shape processing.

Product Features

• High-Precision Fiber Laser: Utilizes a high-precision fiber laser to perform automated scribing/cutting operations on solar cells (primarily silicon-based), efficiently dividing whole cells into the required dimensions (such as half-cells).

• Non-Contact Processing: Employs non-contact fiber laser processing, characterized by high precision, fast speed, minimal thermal damage (small Heat Affected Zone), and excellent chippings control. This significantly reduces cell damage and improves product yield.

• Fine Processing Effect: Produces ultra-narrow, uniform kerfs with minimal chipping, maximizing the mechanical strength and electrical performance of the cell. This meets the requirements for subsequent high-precision processes like string soldering and is a key equipment for producing high-efficiency advanced cell components such as half-cut and shingled modules.

• Enhanced Processing Efficiency: Significantly improves the processing efficiency and automation level of solar cell module production lines. It is a core production equipment in photovoltaic manufacturing for enhancing cell utilization and module power output.

Technical Parameters

Product Applications

• Core Process in PV Cell Manufacturing: This equipment is a key device in crystalline silicon solar cell (monocrystalline/polycrystalline) production lines. It is specifically designed to precisely cut complete square or quasi-square wafers (cell precursors) into smaller required cell units (typically half-cells or smaller dimensions). This is a fundamental step in manufacturing high-efficiency solar cell modules.

• High-Efficiency Cell Processing (Half-Cut, Multi-Segmentation Technology): Widely used in producing mainstream half-cut cells and future third-cut or multi-cut cells. Precise laser scribing effectively reduces cell current, minimizes resistive losses and hot spot risk, thereby significantly boosting module power output and reliability.

• Wafer Processing & Module Packaging Stages: Besides cutting cell precursors in cell manufacturing, some equipment is also applied in:

  • Edge Treatment/Scribing after Wafer Cutting: Precision cutting or edge trimming of initial silicon ingot-cut wafers.

  • Cell Scribing/Cutting before Module Encapsulation: Scribing purchased standard full cells before string soldering to meet the needs of specific module designs (e.g., half-cut modules).

• N-Type Cell Technology (TOPCon, HJT, IBC, etc.) & Thinner Wafer Application: Particularly suitable for processing more efficient, thinner, and more fragile N-type cells (like TOPCon, HJT) and the industry's trend towards thinner wafers (e.g., <150μm). Its non-contact, low-thermal-impact "cold" processing characteristics minimize cutting stress, ensuring high cutting yield and electrical performance for high-value cells.

Precautions

• Strict Laser Safety Protection:

  • This equipment uses a high-power fiber laser. The laser beam has extremely high energy; direct or reflected light can instantly burn skin or cause permanent eye damage.

  • Ensure safety interlocks are intact and functional. Always wear laser safety glasses of the specified wavelength during operation and maintenance. Unauthorized personnel are strictly prohibited from entering the work area. Opening protective covers during machine operation is strictly prohibited.

• Emphasize Dust Control & Explosion Prevention:

  • The laser scribing process generates significant amounts of fine silicon dust. Silicon dust is combustible and poses an explosion risk when reaching a certain concentration in air and encountering an ignition source.

  • The equipment must be equipped with an efficient, sealed dust extraction system (typically integrated or externally connected), ensuring its continuous and stable operation. Regularly clean dust collection devices and ducts. Maintain good ventilation in the working environment. Operations that may produce sparks or open flames are strictly prohibited near the equipment.

• Precise Control of Process Parameters:

  • Laser power, frequency, pulse width, scribing speed, defocus amount, and other parameters are crucial for scribing quality (chipping size, Heat Affected Zone, cut depth consistency).

  • When changing cell types (e.g., P-type to N-type, different thicknesses, different materials like TOPCon/HJT) or adjusting cut dimensions (e.g., half-cell to third-cut), process parameters must be re-optimized and validated. Failure to do so can lead to reduced yield, increased breakage rates, or even equipment damage.

• Ensure a Stable and Clean Operating Environment:

  • Temperature & Humidity Control: Core components like lasers and galvanometers are sensitive to temperature and humidity. Ensure ambient temperature (typically 23±2°C) and humidity (typically 40%-60%) remain stable within equipment requirements to prevent condensation, overheating, or performance drift.

  • Cleanliness: Dust, oil, or other contaminants on optical lenses (focusing lens, protective lens, etc.) severely impact laser transmission efficiency and beam quality, leading to poor scribing or even lens damage. Maintain cleanliness inside the equipment and in the surrounding area. Clean or replace optical lenses strictly according to the prescribed schedule.

• Standardized Operation & Regular Maintenance:

  • Operating Procedures: Operators must undergo rigorous training, familiarizing themselves with equipment structure, operating procedures, emergency stop protocols, and safety rules. Loading, unloading, and replacing consumables (e.g., protective lenses) must follow procedures to avoid accidental contact with precision components.

  • Preventive Maintenance: Strictly adhere to the manufacturer's recommended periodic maintenance plan. This includes, but is not limited to: cleaning guide rails and ball screws, checking air/water line flow, calibrating optical systems (e.g., beam path, CCD positioning), inspecting electrical connections, testing safety functions, and replacing wear parts (protective lenses, dust filter cartridges, etc.). Maintain maintenance records to promptly identify and address potential issues.