Manual Solar Cell Fiber Laser Scribing Machine

The Manual Solar Cell Fiber Laser Scribing Machine is a specialized precision processing equipment designed for the photovoltaic industry. It utilizes a high-power-density fiber laser beam, controlled precisely by an operator via a manual movement platform, to perform rapid, clean, non-contact scribing or segmentation of crystalline silicon or thin-film solar cells. This enables efficient cell interconnection, improves module yield rates, and significantly reduces micro-cracks and breakage rates.

Product Features

• High-Precision Non-Contact Laser Processing: Employs a high-energy-density fiber laser beam for processing, ensuring complete non-contact with the material surface. This avoids mechanical stress, significantly reduces micro-cracks, edge chipping, and breakage rates, guarantees smooth and flat cutting edges on the cells, maximizes protection of the cell's electrical performance, and enhances module yield and long-term reliability.

• Manual Flexible Operation & Precise Control: Equipped with a high-precision manual movement platform (typically X-Y two-dimensional), allowing operators to intuitively, flexibly, and finely control the movement path and speed of the laser focus on the cell. Ideal for R&D, experimentation, sampling, or cutting tasks for special-sized cells requiring small batches, multiple varieties, and high precision. Simple operation with a low learning curve.

• Customized Photovoltaic Process & High Efficiency/Cleanliness: Optimized specifically for solar cells (crystalline silicon/thin-film). Laser parameters (power, frequency, pulse width, speed) are flexibly adjustable to match the optimal scribing/cutting requirements of cells with different thicknesses and materials. The laser process involves no tool wear and generates no dust pollution, keeping the processing area clean, reducing subsequent cleaning steps, and improving overall processing efficiency and environmental friendliness.

• Stable, Reliable & Economical Equipment: Features long-life, maintenance-free fiber lasers with high photoelectric conversion efficiency, ensuring stable and reliable operation. The overall structure is relatively simple and compact, with significantly lower acquisition and maintenance costs compared to fully automated equipment. It represents a cost-effective solution for achieving high-quality, low-damage cell scribing/segmentation tasks in laboratories, pilot lines, or small-scale production.

Technical Specifications

Product Applications

• PV Cell R&D & Process Development: Used in laboratories, research institutes, and R&D departments of cell/module manufacturers for cutting process research and parameter optimization of new cell technologies (e.g., HJT, TopCon, perovskite tandem cells), new substrates (ultra-thin silicon wafers, flexible substrates), or novel interconnection processes (e.g., screenless, SMBB). Its manual flexibility allows for rapid adjustment of laser parameters (power, frequency, speed, path) and micron-level precision cutting tests to evaluate cut quality (edge chipping, micro-cracks, heat-affected zone), efficiency, and impact on cell electrical performance, providing critical data support for new process mass production.

• Small-Batch Production & Custom Specifications: Suitable for pilot lines, sampling centers, or small-scale module production. Handles cutting requirements for non-standard size cells (customized modules), irregularly shaped cells, experimental cell groups (e.g., BIPV prototypes), or special materials (e.g., IBC cells). Manual operation adapts flexibly to varying product specifications and cutting paths, meeting the high-precision, low-damage cutting demands of small-batch, multi-variety orders without the cost of expensive fully automated lines.

• Product Quality Sampling & Failure Analysis: Used in quality inspection laboratories of cell manufacturers or module factories for Destructive Physical Analysis (DPA) of production line cells or finished modules. Enables precise cutting of specific areas (e.g., edges, busbar intersections, suspected hidden crack points) to prepare samples for observing microstructures of cut surfaces, detecting micro-crack propagation, assessing cutting process consistency, or analyzing component failure causes (e.g., broken busbars, fragments), providing direct evidence for process improvement and yield enhancement.

• Vocational Education & After-Sales Repair Support: Serves as a practical teaching device in PV vocational schools and training institutions. Its relatively intuitive and safe operation (non-contact, enclosed light path) and clear demonstration of laser cutting principles and effects make it an ideal platform for training personnel in PV cell precision processing technology. Also supports module factories or third-party repair stations for precise cutting of small quantities of replacement cells or removal of locally damaged cells during component disassembly and repair.

Precautions

• Strict Laser Safety Protection: ABSOLUTELY avoid direct eye exposure to the laser beam or reflected light during operation! Must wear professional laser safety glasses specified for the device wavelength (typically 1064nm or similar). Ensure device protective covers/safety interlocks are intact and always closed. NEVER activate the laser if the cover is open or interlocks are disabled. Prominent laser warning signs must be posted in the work area, and unauthorized personnel must be kept away.
• Ensure Operating Environment & Device Status: Use the device in a clean, dry, and strong electromagnetic interference-free environment. Avoid dust, smoke, or metal splatter affecting optical components and moving parts. Device grounding (especially laser, optical lenses, guides) must be reliable to prevent electrostatic damage to sensitive electronics and the laser. Check that the cooling system operates normally, air pressure is stable, and all connecting cables are secure and undamaged before startup.
• Precise Positioning & Material Confirmation: Ensure precise positioning when placing the cell. The laser focus point must accurately fall within the active area of the cell requiring scribing to avoid damaging edges or electrode busbars. Clearly identify the type (e.g., P-type PERC, N-type TopCon/HJT, thickness) and material of the cell to be processed. Different materials are highly sensitive to laser parameters (wavelength, power, pulse width); incorrect settings can cause poor cutting or severe damage.
• Standardized Operating Procedures: NEVER move the platform rapidly or roughly while the laser is emitting! Manual movements should be smooth and constant to ensure precise laser scanning along the intended path. Follow the principle: "Focus first, test second, process last." Use dedicated focusing tools to calibrate the laser focus to the cell surface; verify parameters and results on scrap pieces or designated test areas; only process formal cells after confirmation. Closely monitor the cutting effect (smoke, sparks, abnormal sounds) and cell status during processing; stop immediately if abnormalities occur.